Flux-free C-Solder joins dissimilar materials - including carbon

Goodfellow Cambridge Ltdvisit website


Flux-free C-Solder joins dissimilar materials - including carbonGoodfellow is now supplying the innovative new family of C-Solder tin-based, flux-free soldering alloys for joining dissimilar materials, including carbon materials. The resulting bond is both mechanically strong and electrically conductive.

C-Solder joins the following materials:

  • Carbon materials including carbon fibres or carbon nanotube fibres in carbon–carbon arrangements
  • Carbon to metals (eg copper, aluminium, titanium, stainless steel), ceramics and glass materials
  • Aluminium to aluminium without using flux

Key features of C-Solder are:

  • Melting point: 232degC (solidus temperature)
  • Density: Approximately 7.4g/cm3
  • Excellent flow
  • Good wetting of surfaces to be joined
  • Electrically and thermally conductive
  • Not affected by cleaning solvents
  • Does not leave a residue
  • Not flammable
  • Flux-free and lead-free

For more information go to and search for C-Solder.

06 November 2017

Goodfellow Cambridge Ltdvisit website
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