New headers for ME-IO housings

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New headers for ME-IO housingsPhoenix Contact is expanding the connection technology portfolio of ME-IO series electronics housings: the new PCB headers of high-temperature LCP plastic, suitable for THR soldering, are well suited for integration into the SMT process.

The headers, with pitches of 3.45mm and 5.0mm, each feature two or three slots for PCB connectors with pitches of 1.5mm and 2.5mm. As a result, there are now fully equipped headers available for reflow-soldering for the 4- and 6-pos. connectors, as well as fully and partially equipped versions for wave soldering. The PCB headers are designed for currents up to 8A and voltages up to 320V.

More information about the ME-IO series electronics housings can be found at

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