Posted to News on 24th Oct 2024, 09:30
Emerson to showcase packaging solutions that advance future of automation
Emerson will exhibit its latest Floor to Cloud packaging solutions at PACK EXPO Chicago. Advancing the boundless future of automation, Emerson factory automation solutions and its Floor to Cloud approach empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.
Visitors to North Building Level, Booth 5345, can view highlights from the extensive portfolio, which includes AVENTICS, Branson, Movicon, PACEdge and PACSystems solutions. Packaging automation experts will demonstrate how a Floor to Cloud approach unlocks trapped data and connects islands of automation, giving manufacturers the visibility and control to solve critical challenges and ambitious goals.
Attendees will learn how to accelerate net zero progress, raise overall equipment effectiveness (OEE) asset by asset, and empower teams with data to drive continuous improvement across the factory floor.
In addition to showcasing its packaging automation solutions, Emerson will also sponsor two events, the annual Packaging and Processing Women's Leadership Network (PPWLN) breakfast and the Amazing Packaging Race.
As part of the Amazing Packaging Race, teams from US colleges, trade schools and universities race to complete tasks and solve problems at booths across the PACK EXPO show floor.
