Infineon's XENSIV MEMS microphones now at Mouser

Infineon XENSIV microphones are designed for applications that require low self-noise, wide dynamic range, low distortion and a high acoustic overload point. The microphones incorporate Infineon's dual-backplate microelectromechanical systems (MEMS) technology to enable high linearity of the output signal within a dynamic range of up to 105dB. The dual-backplate MEMS technology is based on a miniaturised symmetrical microphone design, similar as used in studio condenser microphones, which generates a truly differential signal. The technology allows improved high-frequency immunity for better audio signal processing and increases the acoustic overload point of 10-percent total harmonic distortion (THD) to 135dB SPL.

The 4mm × 3mm microphones feature a noise floor of just 25dBA (69dBA signal-to-noise ratio (SNR)), with distortion less than 1 per cent, even at sound pressure levels of 128dB SPL. For design agility, the IM69D120 microphone has been specifically designed to preserve the 69dBA SNR within the dynamic range of a 16-bit system, whereas the IM69D130 is well suited for 20-bit systems. The SNR is an improvement of 5dB compared with a conventional MEMS microphone, essentially doubling the possible distance between a user and the device capturing a voice command. In addition, the microphones' flat frequency response and tight manufacturing tolerance result in close phase matching of the microphones, benefiting microphone array applications.

Follow the link to learn more about the IM69D120 and IM69D130 XENSIV MEMS microphones at Mouser.