One-component epoxy resin cures at low temperatures

TB2212B can cure in 30 minutes at temperatures as low as 80degC or cure time can be reduced to one minute at 150degC. The resulting benefits include usage on temperature-sensitive components, energy savings, no mixing and simplified automation.

This new epoxy has been developed for general bonding, sealing, potting and moulding. Typical applications include relay sealing, chip bonding, impregnation of small motor coils, component potting, as well as numerous other electronic component uses.

ThreeBond TB2212B consists of one-component epoxy resin, which is denatured to have all the excellent properties of epoxy resin such as strong adhesion strength, chemical resistance, electrical properties and mechanical strength. However, unlike two-component compounds, TB2212B requires no weighing, mixing, stirring, de-foaming or other time-consuming operations. Furthermore, automated dispensing equipment can further improve productivity. The solventless resin contains more than 99 per cent non-volatile matter, so there is minimal shrinkage while curing and low out-gassing ensures a safe working environment. Availability is in 1kg, 4kg and 20kg packs.