TDK Ultra-Compact Bluetooth Smart Module now at Mouser

The TDK SESUB-PAN-T2541 Bluetooth v4.0 Module features TDK's proprietary SESUB technology. A Texas Instruments CC2541 Bluetooth SoC die is mounted onto a thin substrate, along with all peripheral circuitry including a 32MHz crystal, bandpass filter, and capacitors. This results in a module about 65 per cent smaller most competitive products. All I/Os from the substrate layers are also routed to a ball grid array (BGA) footprint on the module's bottom surface. Interfaces include UART, SPI, I2C, and I/O. All this functionality helps to speed the hardware design process, allowing fast and easy implementation of Bluetooth connectivity. Output power is rated at 0 dBm (typ.), with a communication range of 10m, depending on line of sight and antenna characteristics.

TDK's SESUB-PAN-T2541 Bluetooth v4.0 Module targets low-power, wireless applications, including consumer applications as well as wireless sensors, cable replacement applications, instrumentation, heart rate monitors, and blood glucose meters. Other applications include Internet of Things and Wearable devices.

The SESUB-PAN-T2541 Bluetooth v4.0 Module is available now through Mouser Electronics in an ultra-compact, 4.6mm × 5.6mm × 1.0mm footprint, with a slim insertion height of just 1mm. To learn more, visit www.mouser.com/new/tdk/tdk-sesub-pan-t2541.