Featuring the combination of electrical insulation properties and thermal conductivity, Master Bond Supreme 3HTND-2GT can be used for a variety of applications including bonding, sealing, glob top and die attach. This toughened epoxy system bonds well to a wide variety of substrates used in electronics, including metals, composites, ceramics and many plastics.
As a one-component system, Supreme 3HTND-2GT does not require mixing and features a thicker viscosity with limited flow characteristics. Unlike many epoxies it can be readily and efficiently applied to a defined area. It cures quickly in 20-30min at 250degF or in 5-10min at 300degF with very low shrinkage. Supreme 3HTND-2GT can cure in thicknesses of up to 1/8 inch if needed.
In addition, this dimensionally stable system is capable of withstanding rigorous thermal cycling and shocks. Thermally stable, the service temperature range for this system is first rate at -100degF to +400degF. It resists chemicals well, including water, acids, bases and many solvents. Particularly noteworthy is its low level of ionic impurities.
Supreme 3HTND-2GT is yellowish tan in colour and is available in a variety of packaging including syringes, cartridges, pints, quarts and gallon containers.
Master Bond Supreme 3HTND-2GT is a multifunctional system for glob top, die attach, bonding and sealing applications featuring thermal conductivity, high temperature resistance and toughness. Read more at www.masterbond.com/properties/flexibilized-and-toughened-adhesive-systems.