Think IO-Link for efficient manufacturing processes

IO-Link is quickly becoming a critical element of the manufacturing environment and forming a strong backbone for industrial networks. As a founding member of the IO-Link consortium and the market leader in Distributed Modular I/O utilising IO-Link, Balluff offers the most devices available in the market encompassing I/O and connectivity systems.

Find out more about how I-O Link can be easily integrated in existing systems to help reduce maintenance costs, achieve optimum efficiency and productivity while reducing downtime, gone are the days of a single faulty device causing mass facility shutdowns.

As it is network neutral IO-Link also offers flexibility and can be easily configured across multiple vendors, thus reducing the cost of design and implementation. A simplified installation process through a uniform standard interface is as easy as attaching a standard connector.

Balluff will also be showcasing a variety of technologies including object detection, vision, industrial identification and fluid sensors for the primary, secondary or end-of-line packaging industry. The company's aim is to add value to automated systems by providing a wide range of enabling technologies that unlock hidden productivity potential.

Visit Stand F50 at the PPMA exhibition to find out more about I-O Link and the Balluff range of products, or go to www.balluff.co.uk.