Posted to News on 30th Jan 2008, 11:28
Tough one-component epoxy is electrically conductive
Master Bond EP11SIC is a cost-effective, silver-filled epoxy resin featuring high electrical and thermal conductivity. A convenient one-component system with flexible cure schedules, it meets specific processing requirements. It has superior adhesion to both metallic and non-metallic substrates, with a tensile strength greater than 6000psi and a tensile sheer strength over 1500psi. This tough EP11SIC filled system resists thermal shock, high temperatures and chemicals. It is recommended for bonding, potting, sealing and coating over the wide temperature range of -50 to +150degC.
Master Bond Polymer System EP11SIC is supplied as a silver-coloured flowing paste. The gel time at 150degC is about 20 to 25 minutes. The cure is about 40 to 50 minutes at 175degC. EP11SIC has a volume resistivity of less than 0.001ohm-cm and a thermal conductivity of 7.9W/m-degK. Master Bond Polymer System EP11SIC is particularly well suited for making electrically conductive connections in sensitive electronic or electrical components that are expected to withstand severe service conditions. It adjusts to mechanical and thermal stresses without damaging the components thanks to its physical strength and toughness.
For further information visit www.masterbond.com or email [email protected].
