Machine Building

New profiles and elements added to item range

Machine Building Systems reports that numerous profiles and additional functional elements have recently been added to the popular and versatile item range.

1st February 2018

RenAM 500Q: Pioneering productivity in additive manufacturing

To improve additive manufacturing productivity and lower cost per part, Renishaw is launching the RenAM 500Q. Featuring four 500W lasers, the compact machine will improve productivity in the most commonly used platform size, to bring the benefits of additive manufacturing to a wider range of industries.

1st February 2018

Hammond 1553 ergonomic handheld enclosures from JPR Electronics

JPR Electronics is now stocking an extended range of the very successful Hammond 1553 enclosures, ergonomically designed for hand-held comfort. Manufactured in rugged ABS the enclosures are available in three sizes and are suitable for instrumentation, POS, mobile data gathering and test equipment. A soft grey edge grip may be specified for secure and comfortable handling.

1st February 2018

Now at Mouser: TDK's ultra-thin piezohapt actuator

Mouser Electronics is now stocking the PiezoHapt ultra-thin actuator from TDK. Expanding TDK's portfolio of haptic devices, including the PowerHap actuator, the PiezoHapt is one of the world's thinnest haptic components on the market today. With a thickness of only 0.35mm and a very short response time of just 4 milliseconds, the PiezoHapt is significantly thinner and more energy efficient than conventional eccentric motors or linear resonance actuators.

1st February 2018

NSK launches world's fastest high-load ball screws

NSK is introducing what are claimed to be the world's fastest high-load ball screws, capable of linear speeds of up to 3m/s - which is double what is normally achievable with conventional balls screws in this type of application. The new additions to the HTF-SRE and HTF-SRD series mean applications such as the clamping and dynamic axes of all-electric plastic injection moulding machines can now benefit from faster acceleration and higher final speed.

31st January 2018

BOGE introduces sustainable lubrication packaging

BOGE has become the first compressor manufacturer to offer lubricant in environmentally friendly packaging, thanks to the launch of its Lube Cube, an ecological alternative to traditional plastic containers.

31st January 2018

Smart actuator optimises control valve performance

To obtain the precision required of many PLC flow control systems, Badger Meter is launching its next-generation Smart Electric Valve Actuator (SEVA). Available through Pump Engineering, the actuator is built with military-grade components to withstand extreme conditions, while the microprocessor-controlled linear stepper motor provides exceptional positional accuracy to give the reliability, accuracy and repeatability needed.

31st January 2018

Industrial Ethernet gets boost from power quality specialist

REO UK is adding the industrial Ethernet communication standard PROFINET and the industrial network protocol EtherNet/IP to its range of Fieldbus interfaces. The two additions will help manufacturers improve power control in industry 4.0 applications in food and beverage manufacturing, process engineering, water treatment and electroplating. REO UK has added the flexibility of PROFINET and EtherNet/IP to models in its range of REOTRON power controllers and its range of REOVIB vibratory feeder controllers.

31st January 2018

WLAN and Bluetooth transmission in a single module

The Ethernet Port Adapter (EPA) Bluetooth and WLAN wireless modules from Phoenix Contact are being replaced by the EPA 2 generation models, with immediate effect.

30th January 2018

Embedded motherboard that suits all high-end applications

congatec is introducing the conga-IT6, a Mini-ITX embedded motherboard for high-end applications that offers high scalability across all suitable embedded processor sockets thanks to its COM Express Type 6 slot. Users of the new motherboard can scale their applications across all relevant processor generations and manufacturers as required, thereby keeping up-to-date with developments in high-end embedded computing.

30th January 2018